Semiconductor Multi Test Options Tab

NI TestStand 2017 Semiconductor Module Help

Edition Date: July 2018

Part Number: 373892H-01

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The Options tab contains the following options:

  • Stop Performing Tests after First Failure—When you enable this option and a test fails, the Semiconductor Multi Test does not evaluate any subsequent tests in the step and sets the remaining test results to Skip.
  • Evaluation Comparison Mode—Select how the step compares limits for all tests the step specifies. This option is available only when you specify at least one test with a low and high limit on the Tests tab.
  • Test Numeric Display Format—Displays the TestStand numeric format associated with the limits and measurement data. The numeric format determines how the Tests tab displays numeric values and how the TestStand report generators display numeric values in reports. Click the Edit button to launch the Numeric Format dialog box, in which you can specify the numeric format.
  • Multisite Option—Select one of the following options to specify how the step executes the step code module on multiple sites:
    • One thread per subsystem—Execute the code module for each subsystem in a separate thread. The Semiconductor Multi Test step identifies subsystems by using the pin map and the pins shown in the SemiconductorModuleContext Pins control.
      Note Note  Relays do not affect how TSM computes subsystems.
    • One thread only—Execute the code module for all sites in a single thread.
    • One thread per site—Execute the code module for each site in a separate thread. Use this option only when the code module does not use hardware shared among multiple sites.
    Notes Notes
    • TSM does not synchronize executions when you use the Parallel process model
    • Semiconductor Multi Test steps in the ProcessSetup and ProcessCleanup sequences always execute as if you specified the One thread only Multisite Option.
  • Multisite Execution Diagram—When you associate a pin map file with the sequence file, this diagram shows the threads the step uses to execute code modules when executing with the Batch process model using multiple sites. Each rectangle represents a single thread. The numbers within the rectangle represent the sites tested in the same thread. Each thread corresponds to one of the test socket threads. The step determines which test socket thread executes the code module at run time.
  • SemiconductorModuleContext Pins—Shows the list of pins the SemiconductorModuleContext object contains at run time. By default, the SemiconductorModuleContext object contains all pins in the pin map file. You can improve performance in some situations by specifying only the pins you access in the code module. Use the Include System Pins and Specify DUT Pins options to specify individual pins to include in the SemiconductorModuleContext object.
    Note Notes  
    • The SemiconductorModuleContext object for steps in the ProcessSetup and ProcessCleanup sequences always contains all DUT and system pins regardless of the Include System Pins and Specify DUT Pins options.
    • The SemiconductorModuleContext object always contains all site and system relays.
  • Include System Pins—Includes all system pins from the pin map file in the SemiconductorModuleContext object.
  • Specify DUT Pins—Enable this option to specify DUT pins from the pin map file to include in the SemiconductorModuleContext object. Enable the checkbox next to the pin or pin group you want to include in the SemiconductorModuleContext object. When you select a pin group, the tab dims the individual pins that belong to the pin group.

See Also

Multisite Programming Techniques


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