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The NI 5624R is protected against excessive temperatures and shuts down in the presence of excessive heat. When the device shuts down, it automatically loads a low-power, nearly empty FPGA image. Any user FPGA program or FPGA I/O stops, and any VI that tries to read or write to the device returns an error.
You can monitor for thermal shutdown using the Read Device Status VI in the Configuration design library, as shown in the sample projects. If a thermal shutdown has occurred, the device also shows an error state in MAX and shows an error if you run the Self-Test.
To recover from thermal shutdown, resolve the excessive temperature and restart the system. Check that the ambient temperature around the chassis is within specifications and that the IF digitizer is receiving proper airflow. Make sure that chassis fans are clean and that filler panels or slot blockers cover any empty slots to maximize cooling airflow. If the chassis has multiple fan speed settings, ensure the fans are set to the highest setting. Position the chassis so that inlet and outlet vents are not obstructed. For more information about optimal chassis positioning, refer to the chassis documentation.
Monitor temperature in your application to detect rising temperatures before they lead to shutdown. To monitor how far the device is from the limit, use the Read Temperature VIs in the Configuration design library, as shown in the sample projects, and select the Thermal Shutdown Margin option. On the NI 5624R, thermal shutdown is based on FPGA temperature, and the Thermal Shutdown Margin is therefore equal to difference between the FPGA Temperature Limit and the FPGA Temperature.
|Note The Device Temperature option in the Read Temperature VIs is for calibration purposes and does not directly affect thermal shutdown.|
Make sure your application has a wide enough thermal shutdown margin to allow for temperature variations between your development environment and deployment environment. The deployed application may run hotter or cooler than in it does in development due to hardware differences or variations in ambient temperature, air flow, chassis positioning, adjacent modules, power consumption, and other factors.